Veracode, the global leader in application risk management, today announced significant platform innovations introduced through the second half of 2025. Headlining the release is Package Firewall, an ...

Abstract: The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome ...

The aim of this project is to provide a Python 3.12 backport to Debian bookworm. Packages are of course much better manageable than compiling the source from scratch. In my opinion it is also more ...

Most Go developers are using AI-powered development tools, but their satisfaction has been hindered by quality concerns, ...

Abstract: To address the issue of excessive temperature in SiC power module, this work proposes a dual-side cooling (DSC) package structure with highly thermally conductive graphitemolybdenum spacer.