Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.
Background: Vestibular migraine (VM) is the most common cause of episodic vertigo, yet its diagnostic markers remain limited. Perception of verticality, measured via static subjective visual vertical ...
Abstract: Although built-in self-repair (BISR) techniques have been widely used to improve memory yield, their applications to the testing of 3D systems-on-chip (SoC) remained primarily unexplored. In ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results