IEEE

Foundry Monolithic 3D Unlocks Large Throughput Benefits: 3D Memory with Tucked Sense Amplifiers + Logic using Heterogeneous Silicon CMOS + Resistive RAM + Carbon Nanotube FETs

Abstract: We present the first foundry monolithic 3D (M3D) memory + logic circuits – full M3D memory arrays with tucked sense amplifiers (TSAs) driving digital compute logic – through heterogeneous ...
IEEE

3-D Monolithic Stacking of Complementary-FET on CMOS for Next Generation Compute-In-Memory SRAM

Abstract: Monolithic 3D stacking of complementary FET (CFET) SRAM arrays increases integration density multi-fold while supporting the inherent SRAM advantages of low write power and near-infinite ...